NANO SIM CARD 1.35H

Nano SIM Card Connector 1.35H is an ultra-low-profile connector designed for compact mobile devices, IoT modules, and embedded systems requiring secure SIM card integration. With a height of just 1.35mm, it supports space-saving layouts while maintaining reliable electrical and mechanical performance. The connector is constructed with high-temperature thermoplastic housing (UL 94V-0), copper alloy contacts, and a stainless steel shell for enhanced durability.

The contact area is plated with 30μ" gold to ensure excellent conductivity and corrosion resistance, while the solder area features matte tin over nickel with gold flash for optimal solderability. It supports a current rating of 1.0A and 30V DC, with contact resistance ≤50mΩ and insulation resistance ≥1000MΩ at 500V DC. Designed for high-cycle applications, it supports up to 5,000 mating cycles and performs reliably across a wide temperature range from –40°C to +85°C, with humidity tolerance up to 80% RH.

Ideal for smartphones, GPS trackers, smart meters, and industrial communication modules, the Nano SIM Card Connector 1.35H delivers secure signal transmission, compact integration, and global compliance with UL and RoHS standards. Customization options are available to meet diverse OEM/ODM requirements, including pin layout, housing color, and packaging format.

Features

• Ultra-Low Profile Design
  With a height of just 1.35mm, this connector is ideal for space-constrained applications such as slim mobile devices, IoT modules, and embedded systems.
• High Durability for Frequent Use
  Supports up to 5,000 mating cycles, making it suitable for high-usage environments without compromising mechanical integrity.
• Reliable Electrical Performance
  Rated for 1.0A and 30V DC, with contact resistance ≤50mΩ and insulation resistance ≥1000MΩ at 500V DC, ensuring stable signal transmission and low power loss.
• Premium Materials and Plating
  Built with high-temperature thermoplastic housing (UL 94V-0), copper alloy contacts, and stainless steel shell. Contact area is plated with 30μ" gold for enhanced conductivity and corrosion resistance.
• Wide Environmental Tolerance
  Operates reliably in temperatures ranging from –40°C to +85°C, with storage capability under the same range and humidity resistance up to 80% RH.
• Excellent Solderability
  Solder area features matte tin over nickel with gold flash, supporting reflow soldering at 260°C for 10 seconds, ensuring secure PCB integration.
• Global Compliance
  Meets UL and RoHS standards, making it suitable for international markets and environmentally conscious supply chains.

Product Applications

• Smartphones and Tablets
  Enables secure SIM card integration in ultra-slim mobile devices, supporting compact layouts and high-cycle usage.
• IoT Modules and GPS Trackers
  Ideal for space-constrained embedded systems requiring reliable connectivity and long-term durability in outdoor or mobile environments.
• Automotive Telematics Units
  Withstands vibration, temperature fluctuations, and humidity in vehicle-mounted systems such as navigation, fleet tracking, and infotainment modules.
• Industrial Communication Devices
  Suitable for smart meters, remote sensors, and control modules that require stable SIM card contact and environmental resilience.
• Wearables and Portable Electronics
  Supports compact form factors in smartwatches, handheld terminals, and portable routers, where low profile and high mating cycles are critical.
• Medical and Diagnostic Equipment
  Applicable in connected medical devices that require secure data transmission via SIM-based cellular networks.